: Guangdong Taijin Semiconductor Technology Co., Ltd

A manufacturer for semiconductor package equipment include Auto Molding system , Trim & Form singulation System ,Lead frame stamp tools,MGP mold

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Rectangular Mirror Polished DIP4 MGP Mould For Semicon Processing

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Semiconductor Molding Machine [25]
Trim And Form Machine [25]
IC Lead Frame Stamping Mold [19]
MGP Mold [30]
Trimming Forming Dies [25]
Mold Chase [6]
Semiconductor Molding Equipment [25]
Chip Sorting Machine [25]

Guangdong Taijin Semiconductor Technology Co., Ltd

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Rectangular Mirror Polished DIP4 MGP Mould For Semicon Processing

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Rectangular Mirror Polished DIP4 MGP Mould For Semicon Processing

DIP4 MGP Mold Technical Parameters 1. The roughness of the cavity can achieve 0.2um.max; 2. Special products can increase the design of vacuum and built -in core pumping mechanisms; 3. According to ...

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Semicon Processing MGP Mould

Mirror Polished MGP Mould

DIP4 MGP Mold

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