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Guangdong Taijin Semiconductor Technology Co., Ltd
A manufacturer for semiconductor package equipment include Auto Molding system , Trim & Form singulation System ,Lead frame stamp tools,MGP mold
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Rectangular Mirror Polished DIP4 MGP Mould For Semicon Processing

Guangdong Taijin Semiconductor Technology Co., Ltd
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Rectangular Mirror Polished DIP4 MGP Mould For Semicon Processing

Rectangular Mirror Polished DIP4 MGP Mould For Semicon Processing

DIP4 MGP Mold Technical Parameters 1. The roughness of the cavity can achieve 0.2um.max; 2. Special products can increase the design of vacuum and built -in core pumping mechanisms; 3. According to ...

Product Tags:

Semicon Processing MGP Mould

      

Mirror Polished MGP Mould

      

DIP4 MGP Mold

      
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